Abstract
Use of Peltier cooling in down-hole seismic tooling has been restricted by the performance of such devices at elevated temperatures. Present paper analyses the performance of Peltier cooling in temperatures suited for down-hole measuring equipment using measurements, predicted manufacturer data and computational fluid dynamic analysis. Peltier performance prediction techniques is presented with measurements. Validity of the extrapolation of thermoelectric cooling performance at elevated temperatures has been tested using computational models for thermoelectric cooling device. This method has been used to model cooling characteristics of a prototype downhole tool and the computational technique used has been proven valid.
| Original language | English |
|---|---|
| Pages (from-to) | 44-53 |
| Number of pages | 10 |
| Journal | Case Studies in Thermal Engineering |
| Volume | 10 |
| DOIs | |
| Publication status | Published - 13 Feb 2017 |
Keywords
- Down-hole tools
- Peltier cooling
- Thermal boundary layer
- Thermoelectric cooling
- Thermoelectric refrigeration
ASJC Scopus subject areas
- Engineering (miscellaneous)
- Fluid Flow and Transfer Processes
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