TY - GEN
T1 - CFD modelling of thermo-electric devices for thermal management in downhole tools
AU - Weerasinghe, Rohitha
AU - Hughes, Thomas P.
N1 - Publisher Copyright:
© 2015 IEEE.
full text from https://uwe-repository.worktribe.com/OutputFile/829915
PY - 2016/1/25
Y1 - 2016/1/25
N2 - Investigation of oil and gas fields using vertical seismic profiling subjects the electronics used to extreme temperatures and pressures. As wells become deeper, the need for effective thermal management in instrumentation and the demands placed on the tools increases. Various techniques including vacuum insulation, heat pipes, phase change media and thermo-electric cooling (TEC) devices are used to maximise the time equipment can be exposed to these hostile conditions. The performance of such devices is temperature dependent and the level of cooling attained is a function of thermal efficiency. This work examines the effect of different TEC devices on the thermal performance of a commercially available Vertical Seismic Profiling tool. Experimental validation of the model is based on measurements and is presented here. The predictions agree closely with the measurements and the model can be used as a computational tool reducing cost and time in measurements.
AB - Investigation of oil and gas fields using vertical seismic profiling subjects the electronics used to extreme temperatures and pressures. As wells become deeper, the need for effective thermal management in instrumentation and the demands placed on the tools increases. Various techniques including vacuum insulation, heat pipes, phase change media and thermo-electric cooling (TEC) devices are used to maximise the time equipment can be exposed to these hostile conditions. The performance of such devices is temperature dependent and the level of cooling attained is a function of thermal efficiency. This work examines the effect of different TEC devices on the thermal performance of a commercially available Vertical Seismic Profiling tool. Experimental validation of the model is based on measurements and is presented here. The predictions agree closely with the measurements and the model can be used as a computational tool reducing cost and time in measurements.
UR - https://www.scopus.com/pages/publications/84966344923
U2 - 10.1109/THERMINIC.2015.7389611
DO - 10.1109/THERMINIC.2015.7389611
M3 - Conference contribution
AN - SCOPUS:84966344923
T3 - THERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems
BT - THERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2015
Y2 - 30 September 2015 through 2 October 2015
ER -